Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration release_xl5ab5jyhveidft7xoo4fnjf7e

by Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow, Technische Universität Berlin, Technische Universität Berlin

Published by Technische Universität Berlin.

2019  

Abstract

Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers or package-on-package approaches, larger substrate formats are also targeted. Manufacturing is currently done on a wafer level of up to 12"/300 mm and 330 mm respectively. For a higher productivity and, consequently, lower costs, larger form factors are introduced. Instead of following the wafer level roadmaps to 450 mm, panel level packaging (PLP) might be the next big step. Both technology approaches offer a lot of opportunities as high miniaturization and are well suited for heterogeneous integration. Hence, FOWLP and PLP are well suited for the packaging of a highly miniaturized energy harvester system consisting of a piezo-based harvester, a power management unit and a supercapacitor for energy storage. In this study, the FOWLP and PLP approaches have been chosen for an application-specific integrated circuit (ASIC) package development with integrated SMD (surface mount device) capacitors. The process developments and the successful overall proof of concept for the packaging approach have been done on a 200 mm wafer size. In a second step, the technology was scaled up to a 457 × 305 mm2 panel size using the same materials, equipment and process flow, demonstrating the low cost and large area capabilities of the approach.
In text/plain format

Archived Files and Locations

application/pdf  5.2 MB
file_e65mgl22f5eznaa747rqihxjqm
depositonce.tu-berlin.de (publisher)
web.archive.org (webarchive)
Read Archived PDF
Preserved and Accessible
Type  article
Stage   published
Date   2019-12-23
Language   en ?
Work Entity
access all versions, variants, and formats of this works (eg, pre-prints)
Catalog Record
Revision: e0f0b7ab-f970-4865-9fe4-6c261dbcd653
API URL: JSON