@article{sugiyama_bansaku_tsuzimoto_tachikawa_1981,
title={Reliability Considerations of Flip Chip Components for Automotive Electronic Applications},
DOI={10.1155/apec.9.87},
abstractNote={Electronic devices for automotive electronic applications have to be operated under extreme environmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic ones using thick film technology.This paper presents results that shows that our flip chip IC technology can satisfy the high reliability requirements of automobile electronics.},
publisher={Hindawi Limited},
author={Sugiyama and Bansaku and Tsuzimoto and Tachikawa},
year={1981}
}