Spline Solution for a Fin with Temperature Dependent Thermal Conductivity release_mvyzkzcgr5eo3joq2feo32gzwu

Abstract

Fins are widely used to enhance heat transfer between primary surface and the environment in many industrial applications. Spline collocation method has been used to evaluate the efficiency of fins with temperature dependent thermal conductivity for exponential profile. The temperature distribution, fin efficiency and fin heat transfer rate are presented for exponential profile and a range of values of heat transfer rate are presented for exponential profile and a range of values of heat transfer parameters. The result reveal that spline solution is very effective and convenient, Comparison of the results DTM and Spline solution was shown that the analytical method and numerical data are in a good agreement with each other.
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