The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer release_heewx6zn3zhb7i2q4vcdhlxtb4

by Kamotesov Sergkei, Philippe Lombard, Vincent Semet, Bruno Allard, Mael Moguedet, Michel Cabrera

Released as a paper-conference by IEEE.

2018  

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