Liquid-Solid Contact in Microbubble Emission Boiling through Void Signals.
気泡微細化沸騰におけるボイド信号に基づく固液接触の考察 release_gy7zs6rmezas5oxfrvjp5ps2gu

by Satoshi KUMAGAI, Tsuyoshi UHARA, Toshihiko NAKATA, Masaaki IZUMI

Published in TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B by Japan Society of Mechanical Engineers.

2001   Volume 67, Issue 661, p2304-2310

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