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Thin, high atomic weight refractory film deposition for diffusion barrier, adhesion layer, and seed layer applications
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by
S. M. Rossnagel
Published
in Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena by American Vacuum Society.
1996 Volume 14, p1819
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Year 1996
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published
Year 1996
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10.1116/1.588562
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Worldcat
SHERPA/RoMEO (journal policies)
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Semantic Scholar
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