Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe
release_gavayubiuncppiqoeqnzhezru4
by
E. Graycochea Jr., F. Gomez, R. Rodriguez, B. Bacquian
2020 p22-26
Abstract
Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) criteria for quad-flat no-leads (QFN) packages. Through package and process conceptualization, the stand-off design located on the leadframe underneath the silicon die corners would result to a steady and consistent BLT during die attach process. With the improved design, die tilt occurrence in die attach process would be mitigated.
In application/xml+jats
format
Archived Files and Locations
application/pdf 206.3 kB
file_7ddj4lz7lfaephpurhfetkhqma
|
www.journaljerr.com (web) web.archive.org (webarchive) |
article-journal
Stage
published
Date 2020-03-13
access all versions, variants, and formats of this works (eg, pre-prints)
Crossref Metadata (via API)
Worldcat
SHERPA/RoMEO (journal policies)
wikidata.org
CORE.ac.uk
Semantic Scholar
Google Scholar