Low-temperature Si/Si and quartz/quartz direct bonding was realized via VUV/O3 activation and bonding mechanisms proposed.
","author":[{"family":"Xu"},{"family":"Wang"},{"family":"Wang"},{"family":"Wang"},{"family":"Kang"},{"family":"Liu"},{"family":"Tian"}],"id":"unknown","issue":"21","issued":{"date-parts":[[2018,3,23]]},"language":"en","page-first":"11528","publisher":"Royal Society of Chemistry (RSC)","title":"Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation","type":"article-journal","volume":"8"}