Associated Releases

2002-06-02 A Wafer-Level Vacuum Packaging Process by RTP Aluminum-to-Nitride Bonding
unknown status | paper-conference
doi:10.31438/trf.hh2002.21

Public Access URLs

publisher https://transducer-research-foundation.org/technical_digests/HiltonHead_2002/hh2002_0081.pdf
webarchive https://web.archive.org/web/20210114085420/https://transducer-research-foundation.org/technical_digests/HiltonHead_2002/hh2002_0081.pdf

Data Integrity Checksums

SHA-1 a5aa83cb04f376600afa2b0b1d8348c79f608f9f
SHA-256 eff43a2b3db005a1386ba66c91694113e07243ed2ce62a238c0197d7f242fcde
MD5 7f4e883fa9a4c7f3de2e315a6f7141c4
Size  1.7 MB
MIME Type  application/pdf
Work In Progress

This entity has not been "accepted" into the official database yet.

Catalog Record
State: wip
Revision: ecc59681-1bf1-4527-b8b6-71edba5c65fe
API URL: JSON