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IEEE transactions on electronics packaging manufacturing (Print)
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Institute of Electrical and Electronics Engineers
Homepage URLs
http://ieeexplore.ieee.org/servlet/opac?punumber=6104 |
Example Publications
A Fluxless Flip-Chip Bonding for VCSEL Arrays Using Silver-Coated Indium Solder Bumps
K.-M. Chu, J.-S. Lee, H.S. Cho, H.-H. Park, D.Y. Jeon
2004
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IEEE transactions on electronics packaging manufacturing (Print)
doi:10.1109/tepm.2004.843155
Table of contents
2004 | IEEE transactions on electronics packaging manufacturing (Print)doi:10.1109/tepm.2005.844550
Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder
Ching-I. Chen, Ching-Yu Ni, Chi-Min Chang, Shao-Chiun Wu, De-Shin Liu
2008
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IEEE transactions on electronics packaging manufacturing (Print)
doi:10.1109/tepm.2008.2002025
A "defect level versus cost" system tradeoff for electronics manufacturing
M. Scheffler, P.D. Franzon, G. Troster
2004
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IEEE transactions on electronics packaging manufacturing (Print)
doi:10.1109/tepm.2004.830513